| I&EC | Monday, 27 March 2006 | ||
1:00 PM-4:50 PM Georgia World Congress Center -- B313B, Oral | |||
Advanced Materials for Microelectronic Packaging (Sponsored by Advanced Materials and Nanotechnology Sub-Division) | |||
| Emerging Materials, Development and Modeling | |||
| Organizers: | Annita Zhong James M. Hurley CP. Wong | ||
| 1:00 PM | Introductory Remarks | ||
| 1:05 PM | 189 | Molecular dynamics study of lead free interconnect materials for electronic packaging applications Hai Dong, Kyoung-sik Moon, Lianhua Fan, C. P. Wong, M. I. Baskes | |
| 1:25 PM | 190 | A molecular-level approach to polymer flammability Richard E. Lyon, Stanislav I. Stoliarov, Richard N. Walters | |
| 1:45 PM | 191 | Predicting the glass transition temperature of phenolic-cured epoxy thermosets using additive group contributions James M. Hurley, Vivek Pai, Avin Dhoble | |
| 2:05 PM | 192 | Cure kinetics of no-flow underfills: Effect of reflow profile Prameela Susarla, Maria LaTorre, James F. Kelley, Ryan C. Mills | |
| 2:25 PM | 193 | Improved underfills for copper/low-k flip chip laminate packages Jack Zhang, Puwei Liu, Qing Ji, Gary Shi, Michael Todd | |
| 2:45 PM | Intermission | ||
| 3:05 PM | 194 | Materials science applications of near-field microspectroscopy Richard A. Larsen, Wendy Gardinier | |
| 3:25 PM | 195 | Assessing epoxy mold compound adhesion to microelectronic materials using surface energy measurements Gene Kim, James M. Hurley, Avin Dhoble, Samir Avdic | |
| 3:45 PM | 196 | Superhydrophobic durable silica thin films from sol-gel processing for the application in antistiction of MEMS devices Yonghao Xiu, Lingbo Zhu, Dennis. W. Hess, C. P. Wong | |
| 4:05 PM | 197 | Metallic single-walled carbon nanotubes for transparent conductive films Ya-Ping Sun, Yi Lin, K. A. Shiral Fernando, Xin Wang, Yang Liu | |
| 4:25 PM | 198 | Effects of surface chelating on corrosion control in electronic packaging Yi Li, Kyoung-sik Moon, CP. Wong | |
| 4:45 PM | Concluding Remarks | ||
Previous Session -- Advanced Materials for Microelectronic Packaging (Sponsored by Advanced Materials and Nanotechnology Sub-Division)
Symposium Grid -- Division of Industrial and Engineering Chemistry -- Session Listing
Symposium Grid -- Nanotechnology -- Session Listing
The 231st ACS National Meeting, Atlanta, GA, March 26-30, 2006